Panel FOUP
FOUP for Rectangular Substrates
※FOUP ＝ Front Opening Unified Pod
Panel FOUP
Currently under development, this FOUP is designed specifically for the FO-PLP semiconductor packaging process.
It complies with SEMI Standard E181 and supports automation systems.
Supported substrate sizes based on SEMI standards:
・510 x 515 mm
・600 x 600 mm
Custom sizes are also available upon request.